We are specialists for the sawing of silicon in either wafer or Sliver format, COB circuit boards and ceramic substrates and multi layer ceramic housings.
WAFER SAW / SEPARATION
SMD ASSEMBLY
If your COB assembly requires SMD assembly, we can better provide both technologies for your convenience. Some applications may require active and passive components to be assemble and solder these components up to a high degree of complexity.
CHIP BONDING
Chip bonding refers to a technique by which the individual chips of a wafer are attached to a substrate using an appropriate adhesive. The following technologies are used by the DLS Team. ~ Chip on Board (COB) ~ Chip on Ceramic (COC) ~ Chip on Flex (COF) ~ Chip on Glass (COG) ~ Chip on Metal (COM) ~ Die Stacking
MICRO ELECTRONIC Packaging
Dimation’sDie Level Service provides various different packaging technologies for microelectronic devices, modules and systemsmand accompanies the customer’s ideas from start to finish and through to high volume manufacturing. We do this by offering a range of modular technology steps to ensure optimum production process flows.
When you require failure analysis of a component and or micro electronic assembly, our experienced Team is able to determine in most cases the means of failure of a particular device. We do that by using X-Ray inspection, De capsulation of the component and curve trace evaluation from a known good and failed component.
ENCAPSULATION
Encapsulation is the process of isolating an object from its environment. The purpose is to protect the component from both environmental and mechanical interaction and to enhance its operational reliability. The chip and bond wires may be covered either completely and or partially depending upon the requirements from the application.
WIRE BONDING
Die Level Services Team primarily uses gold ball and aluminum wedge bonding.
Our standard size range from .007” to .00125” wire diameter. When your devices require high temperatures we are capable of delivery a reliable interconnect.
At Dimation, our Die Level Services Team prides themselves on the level of expertise and consistent quality we carry out and ensure our customers that we have all the tools and support they require to ensure the job is completed on time and to services they require. Our level of support and service throughout your project is one of the many reasons why our customers return to us again and again. We know we are not perfect, However, we Strive to be the best. Your feedback is very important to us. Being an AS9100 Service provider requires us to be continually monitoring our processes and focusing on continual improvement. That is an every day commitment and we take it very seriously.
Back to TOP
