Die Level Services © 2021
MicroElectronicpackaging / AssemblySolutions Fast 4U
IC PACKAGING
Die Level Services can perform wire bonding, flip chip or WLP package design and turnkey manufacturing including wafer design and manufacturing right here in the United States.
Wire Bonding Services
The term wire bond or wire bonding is a Micro Assembly service used to describe the process of connecting between a bare die chip (IC) to a substrate, package or other die. At Dimation, we supply the complete set of bonding services required for IC Assembly and use the most up-to-date machinery and bonding materials. Our automated machines includes K&S ICONN Plus Bonders.
Our supported wire Bonding techniques include Ball Bonding and Wedge Bonding supporting a variety of wire diameters in range of 0.5mil up to 2mil, based on project's specifications.
Ball Bonding Services in Dimation are available in gold wire and copper wire. The bonding can be performed in Fine Pitch between pads of up to 35 microns, or a simple standard bond. The most prominent advantage of ball bonding stems from the ability to produce super complex wire loops with multiple tiers levels and crossing wires
Die Level Services related capabilities
- Automatic/manual Ball Gold wire bonding K&S ICON
- Automatic/manual aluminum wedge Bonding K&S
- Ultra low loop, RF profiles, custom profiles
- Au, Cu and Al automatic wire bonding
- High accuracy bond placement.
- ltra-Fine-Pitch.
Creative Packaging
Dimation provides micro-optical assembly services for companies performing in a wide variety of high end optical and photonic fields. Most optical modules are assembled in order to be included in advanced miniature medical systems (like endoscopes, implants, surgery tools), in automotive solutions, in Artificial and Virtual Reality systems, in defence and other optical products.
After carefully reviewing the design we can be ready to move into the R&D assembly phase. This stage can start by building even a single prototypes or a set of optional prototypes.