Providing custom packaging solutions for those customers who only just want one piece. If you want more than one, that's not a problem We can do more if your project requires it, all you need to do is just ask and we will deliver!
Providing the industry with quick turn wire bond packaging as little as just one. We excel in developing a product for a customer when the quantities are small. We specialize in developing conceptual packaging projects with a low cost of ownership.
WAFER LEVEL SUPPORT
Die Level Services
Dice it and slice it, its the first step before you PACKAGEit!
We offer wafer level support of which includes wafer sawing in either full wafer or wafer slivers.
We use conductive or non conductive die attach material to mount our customers die.
Gold Ball bond or Aluminum wire are our current offerings we have at this time. Copper coming soon!
Mixed technology, SMT and Wire Bond technology is in our current offering, typically with using Au wire
WAFER DICING / SORTING
One of the first steps in micro assembly is the process of wafer dicing. We call it Dice and Slice.
We Understand that Counterfeit electronic components are a great threat to electronic many product mfg’s, and can have severe safety consequences to the consumer as well as big commercial costs to the mfg, when a counterfeit components detected in their product.
Electronic packaging can encompass a huge array of sizes, designs, styles and materials. Gaining access to the chip inside - a technique known as decapsulation - is necessary for many reasons including electrical testing, counterfeit prevention, bond wire pull testing and thermal microscopy for failure analysis or competitive analysis.
Curve Trace Analysis
Curve Tracing can be a widely accepted method for finding electrically damaged pins on IC chips. Primarily focusing on a range of solutions from opens and shorts testing on small devices all the way up to Powered curve trace and Latch Up testing on very complex multi power supply devices with thousands of pins.
X-ray inspection gives you the unique ability to “see” what is inside an electronic part or hybrid component without damaging it. Seeing is Believing and and when you can do it without affecting the component why not?