OurDie Level Services Teamwill process your request with the highest level of urgency. Unlike our competition, no project is too big or too small. DLS work well with your Design team and if you don’t have one either you can count on our services or we may align you with one of our partnership relationships to assist you. We can start with as little as a idea on a napkin, or if you have schematics and or existing files we can use them to reduce your cost to ownership. We also provide Research support so if you really would like to dream and we can assist you as well. Just give us a call and we will setup a interview to go over your design or idea.
Dimation, WOW Circuits and Die Level Services are located at our new facility at 5288 Valley Industrial Blvd S. Shakopee, Minnesota. We are about 20 minutes just south west of the airport for your convenience.
Come give us a call and check us out. We have a lot to offer and look forward to helping you with your needs.
The Die Level Services Team has experience with a variety of stacked die techniques. All of these processes are available for use with standard die and do not require custom die or TSVs (through silicon vias).
Advanced Packaging
We pride our self on super fast response. Our Die Level Services Team responds quickly to your request and gets the job done like no other.
Silicon is our specialty
Component De-capsulation
We provide Testing Services and Analysis of which include Integrated Circuit Decapsulation, Die Marking Identification, Microscopy, Curve Trace Pin-Print Analysis, Part Marking Permanency, Basic Functional Test, Program Verification Check, X-Ray Inspection and Visual
